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Conference contributions
Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies
Publication:
Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies
Date
2015
Proceedings Paper
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31700.pdf
1.42 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
van der Veen, Marleen
;
Vandersmissen, Kevin
;
Dictus, Dries
;
Demuynck, Steven
;
Liu, Ran
;
Bin, Xiaomin
;
Nalla, Praveen
;
Lesniewska, Alicja
;
Hall, Laurie
;
Croes, Kristof
;
Zhao, Larry
;
Boemmels, Juergen
;
Kolics, Artur
;
Tokei, Zsolt
Journal
Abstract
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1991
since deposited on 2021-10-23
Acq. date: 2025-10-23
Citations
Metrics
Views
1991
since deposited on 2021-10-23
Acq. date: 2025-10-23
Citations