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Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects
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Authors
Wu, C.
;
Vaisman Chasin, Adrian
;
Demuynck, Steven
;
Horiguchi, Naoto
;
Croes, Kristof
EISBN
978-1-7281-3199-3
ISSN
1541-7026
Conference
IEEE International Reliability Physics Symposium (IRPS)
Journal
na
Title
Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects
Publication type
Proceedings paper
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3
20.500.12860/38205.3
*
2021-11-25T10:04:14Z
validation by library/open access desk
2
20.500.12860/38205.2
2021-11-24T08:53:39Z
validation by library/open access desk
1
20.500.12860/38205
2021-11-02T16:05:16Z
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