Browsing by author "Demuynck, Steven"
Now showing items 1-20 of 144
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1.5×10-9 Ω·cm² Contact Resistivity on Highly Doped Si:P Using Ge Pre-amorphization and Ti Silicidation
Yu, Hao; Schaekers, Marc; Rosseel, Erik; Peter, Antony; Lee, Joon-Gon; Song, Woo-Bin; Demuynck, Steven; Chiarella, Thomas; Ragnarsson, Lars-Ake; Kubicek, Stefan; Everaert, Jean-Luc; Horiguchi, Naoto; Barla, Kathy; Kim, Daeyong; Collaert, Nadine; Thean, Aaron; De Meyer, Kristin (2015) -
3D FinFET gate etch for advanced CMOS scaling
Dupuy, Emmanuel; Altamirano Sanchez, Efrain; Marinov, Daniil; Hody, Hubert; Mertens, Hans; Siew, Yong Kong; Demuynck, Steven; Horiguchi, Naoto (2019) -
3D sequential low temperature top tier devices using dopant activation with excimer laser anneal and strained silicon as performance boosters
Vandooren, Anne; Wu, Zhicheng; Parihar, Narendra; Franco, Jacopo; Parvais, Bertrand; Matagne, Philippe; Debruyn, Haroen; Mannaert, Geert; Devriendt, Katia; Teugels, Lieve; Vecchio, Emma; Radisic, Dunja; Rosseel, Erik; Hikavyy, Andriy; Chan, BT; Waldron, Niamh; Mitard, Jerome; Besnard, G.; Alvarez, A.; Gaudin, G.; Schwarzenbach, W.; Radu, I.; Nguyen, B. Y.; Huet, K.; Tabata, T.; Mazzamuto, F.; Demuynck, Steven; Boemmels, Juergen; Collaert, Nadine; Horiguchi, Naoto (2020) -
A 0.314mm2 6T-SRAM cell built with tall triple-gate devices for 45nm node applications using 0.75NA 193nm lithography
Nackaerts, Axel; Ercken, Monique; Demuynck, Steven; Lauwers, Anne; Baerts, Christina; Bender, Hugo; Boullart, Werner; Collaert, Nadine; Degroote, Bart; Delvaux, Christie; de Marneffe, Jean-Francois; Dixit, Abhisek; De Meyer, Kristin; Hendrickx, Eric; Heylen, Nancy; Jaenen, Patrick; Laidler, David; Locorotondo, Sabrina; Maenhoudt, Mireille; Moelants, Myriam; Pollentier, Ivan; Ronse, Kurt; Rooyackers, Rita; Van Aelst, Joke; Vandenberghe, Geert; Vandervorst, Wilfried; Vandeweyer, Tom; Vanhaelemeersch, Serge; Van Hove, Marleen; Van Olmen, Jan; Verhaegen, Staf; Versluijs, Janko; Vrancken, Christa; Wiaux, Vincent; Jurczak, Gosia; Biesemans, Serge (2004-12) -
A comparison of arsenic and phosphorus extension by room temperature and hot ion implantation for NMOS Si bulk-FinFET at N7 (7nm) technology relevant fin dimensions
Sasaki, Yuichiro; Ritzenthaler, Romain; De Keersgieter, An; Chiarella, Thomas; Kubicek, Stefan; Rosseel, Erik; Waite, Andrew; del Agua Borniquel, Jose Ignacio; Colombeau, Benjamin; Chew, Soon Aik; Kim, Min-Soo; Schram, Tom; Demuynck, Steven; Vandervorst, Wilfried; Horiguchi, Naoto; Mocuta, Dan; Mocuta, Anda; Thean, Aaron (2015-06) -
A comprehensive LER-aware TDDB lifetime model for advanced Cu interconnects
Stucchi, Michele; Roussel, Philippe; Tokei, Zsolt; Demuynck, Steven; Groeseneken, Guido (2011) -
A DRAM compatible Cu contact using self-aligned Ta-silicide and Ta-barrier
Zhao, Chao; Ahn, Jae Young; Horiguchi, Naoto; Demuynck, Steven; Tokei, Zsolt (2008) -
A feasibility study of dual damascene porous SiLK resin with spin-on hard masks
Hoofman, Romano; Michelon, Julien; Verheijden, G.J.A.M.; Waeterloos, Joost; Caluwaerts, Rudy; Schmidt, M.O.; Demeurisse, Caroline; Vandeweyer, Tom; Demuynck, Steven; Tokei, Zsolt; Beyer, Gerald (2004) -
A metal hardmask approach for the contact patterning of a 0.186 μm² SRAM cell exposed with EUV lithography
de Marneffe, Jean-Francois; Goossens, Danny; Vandervorst, Alain; Demuynck, Steven; Goethals, Mieke; Hermans, Jan; Van Roey, Frieda; Baudemprez, Bart; Brus, Stephan; Vrancken, Christa (2008) -
A novel concept for contact etch residue removal
Vos, Ingrid; Hellin, David; Demuynck, Steven; Richard, Olivier; Conard, Thierry; Vertommen, Johan; Boullart, Werner (2007) -
A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond
Op de Beeck, Maaike; Versluijs, Janko; Tokei, Zsolt; Demuynck, Steven; de Marneffe, Jean-Francois; Boullart, Werner; Vanhaelemeersch, Serge; Zhu, Helen; Cirigliano, Peter; Pavel, Elisabeth; Sadjadi, Reza; Kim, Jisoo (2007) -
A way to integrate multiple block layers for middle of line contact patterning
Kunnen, Eddy; Demuynck, Steven; Brouri, Mohand; Boemmels, Juergen; Versluijs, Janko; Ryckaert, Julien (2015) -
ALD as an enabler of self-aligned multiple patterning schemes
Van Elshocht, Sven; Tao, Zheng; Everaert, Jean-Luc; Demuynck, Steven; Altamirano Sanchez, Efrain (2017) -
All-wet removal of post-etch photoresist and sidewall residues: Electrical characterization of 90 nm and 30 nm ½ pitch structures
Le, Quoc Toan; Demuynck, Steven; Suhard, Samuel; Klipp, Andreas; Vereecke, Bart; Vereecke, Guy (2010) -
Alpha-Ta formation and its impact on electromigration
Demuynck, Steven; Tokei, Zsolt; Bruynseraede, Christophe; Michelon, Julien; Maex, Karen (2003) -
Alpha-Ta formation and its impact on electromigration
Demuynck, Steven; Tokei, Zsolt; Bruynseraede, Christophe; Michelon, Julien; Maex, Karen (2004) -
An investigation of ultra low-k dielectrics with high thermal stability for integration in memory devices
Hong, Eun Kee; Demuynck, Steven; Le, Quoc Toan; Baklanov, Mikhaïl; Carbonell, Laure; Van Hove, Marleen; Meynen, Herman (2007) -
Analysis of junctions formed in strained Si/SiGe substrates
Eneman, Geert; Simoen, Eddy; Lauwers, Anne; Lindsay, Richard; Verheyen, Peter; Delhougne, Romain; Loo, Roger; Caymax, Matty; Meunier-Beillard, Philippe; Demuynck, Steven; De Meyer, Kristin; Vandervorst, Wilfried (2004) -
Barrier reliability for Cu contacts
Zhao, Chao; Demuynck, Steven; Van den Bosch, Geert; Tokei, Zsolt; Beyer, Gerald (2007) -
Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
Vandooren, Anne; Wu, Zhicheng; Khaled, Ahmad; Franco, Jacopo; Parvais, Bertrand; Li, W.; Witters, Liesbeth; Walke, Amey; Peng, Lan; Rassoul, Nouredine; Matagne, Philippe; Jamieson, Geraldine; Inoue, Fumihiro; Nguyen, B.Y.; Debruyn, Haroen; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Zheng, T.; Radisic, Dunja; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Besnard, G.; Schwarzenbach, W.; Gaudin, G.; Radu, Iuliana; Waldron, Niamh; De Heyn, Vincent; Demuynck, Steven; Boemmels, Juergen; Ryckaert, Julien; Collaert, Nadine; Mocuta, Dan (2019)