Browsing by author "Miyamori, Yuichi"
Now showing items 1-4 of 4
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Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof (2014) -
Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna-Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof (2015) -
On the thermal stability of physically-vapor-deposited diffusion barriers in 3D through-silicon vias during IC processing
Civale, Yann; Croes, Kristof; Miyamori, Yuichi; Velenis, Dimitrios; Redolfi, Augusto; Thangaraju, Sarasvathi; Van Ammel, Annemie; Cherman, Vladimir; Van der Plas, Geert; Cockburn, Andrew; Gravey, Virginie; Kumar, Nirajan; Cao, Zhitao; Travaly, Youssef; Tokei, Zsolt; Beyne, Eric; Swinnen, Bart (2013) -
Thermal stability of copper through-silicon via barriers during IC processing
Civale, Yann; Croes, Kristof; Miyamori, Yuichi; Thangaraju, Sarasvathi; Redolfi, Augusto; Van Ammel, Annemie; Velenis, Dimitrios; Cherman, Vladimir; Hendrickx, Paul; Van der Plas, Geert; Cockburn, Andrew; Gravey, Virginie; Kumar, Nirajan; Zhitao, Cao; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe; Travaly, Youssef; Tokei, Zsolt; Beyne, Eric; Swinnen, Bart (2011)