Authors

Civale, Yann; Croes, Kristof; Miyamori, Yuichi; Velenis, Dimitrios; Redolfi, Augusto; Thangaraju, Sarasvathi; Van Ammel, Annemie; Cherman, Vladimir; Van der Plas, Geert; Cockburn, Andrew; Gravey, Virginie; Kumar, Nirajan; Cao, Zhitao; Travaly, Youssef; Tokei, Zsolt; Beyne, Eric; Swinnen, Bart

ISSN

0167-9317

Journal

Microelectronic Engineering

Volume

106

Title

On the thermal stability of physically-vapor-deposited diffusion barriers in 3D through-silicon vias during IC processing

Publication type

Journal article

Embargo date

9999-12-31