Publication:

On the thermal stability of physically-vapor-deposited diffusion barriers in 3D through-silicon vias during IC processing

Date

2013
Journal article
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dc.contributor.authorCivale, Yann
dc.contributor.authorCroes, Kristof
dc.contributor.authorMiyamori, Yuichi
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorThangaraju, Sarasvathi
dc.contributor.authorVan Ammel, Annemie
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorCockburn, Andrew
dc.contributor.authorGravey, Virginie
dc.contributor.authorKumar, Nirajan
dc.contributor.authorCao, Zhitao
dc.contributor.authorTravaly, Youssef
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyne, Eric
dc.contributor.authorSwinnen, Bart
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorVan Ammel, Annemie
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-21T06:59:39Z
dc.date.available2021-10-21T06:59:39Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22152
dc.source.beginpage155
dc.source.endpage159
dc.source.journalMicroelectronic Engineering
dc.source.volume106
dc.title

On the thermal stability of physically-vapor-deposited diffusion barriers in 3D through-silicon vias during IC processing

dc.typeJournal article
dspace.entity.typePublication
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