Browsing by author "Gillon, Renaud"
Now showing items 1-7 of 7
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Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
Ivankovic, Andrej; Vanstreels, Kris; Vanderstraeten, Daniel; Brizar, Guy; Gillon, Renaud; Blansaer, Eddy; Vandevelde, Bart (2012) -
Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages
Ivankovic, Andrej; Vanstreels, Kris; Vanderstraeten, Daniel; Brizar, Guy; Gillon, Renaud; Blansaer, Eddy; Vandevelde, Bart (2010) -
Impact of moisture absorption on warpage of large BGA packages during a lead-free reflow process
Vandevelde, Bart; Deweerdt, Rafael; Duflos, Frederic; Gonzalez, Mario; Vanderstraeten, Daniel; Blansaer, Eddy; Brizar, Guy; Gillon, Renaud (2009-10) -
Impact of mold compound filler particles on local thermo-mechanical stress variations
Vanderstraeten, Daniel; Blansaer, Eddy; Gillon, Renaud; Torregiani, Cristina; Vandevelde, Bart (2008) -
Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: characterisation methods and implementation in FEM
Ivankovic, Andrej; Vanstreels, Kris; Hsu, Yung-Yu; Gonzalez, Mario; Brizar, Guy; Vanderstraeten, Daniel; Blansaer, Eddy; Gillon, Renaud; Defloor, M.; Vandaele, K.; Degryse, D.; Vandevelde, Bart (2011-04) -
Practical chip-centric electro-thermal simulations
Gillon, Renaud; Joris, Patricia; Oprins, Herman; Vandevelde, Bart; Srinivasan, Adi; Chandra, Rajit (2008-09) -
The power of green compounds for automotive
Gillon, Renaud; Vanderstraeten, Daniel; Brizar, Guy; Blansaer, Eddy; Vandevelde, Bart (2010)