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Impact of moisture absorption on warpage of large BGA packages during a lead-free reflow process
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Authors
Vandevelde, Bart
;
Deweerdt, Rafael
;
Duflos, Frederic
;
Gonzalez, Mario
;
Vanderstraeten, Daniel
;
Blansaer, Eddy
;
Brizar, Guy
;
Gillon, Renaud
Conference
15th International Workshop on Thermal Investigations of IC's and Systems - THERMINIC
Title
Impact of moisture absorption on warpage of large BGA packages during a lead-free reflow process
Publication type
Proceedings paper
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