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Impact of moisture absorption on warpage of large BGA packages during a lead-free reflow process

Date

2009-10
Proceedings Paper
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dc.contributor.authorVandevelde, Bart
dc.contributor.authorDeweerdt, Rafael
dc.contributor.authorDuflos, Frederic
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVanderstraeten, Daniel
dc.contributor.authorBlansaer, Eddy
dc.contributor.authorBrizar, Guy
dc.contributor.authorGillon, Renaud
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.accessioned2021-10-18T04:28:36Z
dc.date.available2021-10-18T04:28:36Z
dc.date.issued2009-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16432
dc.source.conference15th International Workshop on Thermal Investigations of IC's and Systems - THERMINIC
dc.source.conferencedate7/10/2009
dc.source.conferencelocationLeuven Belgium
dc.title

Impact of moisture absorption on warpage of large BGA packages during a lead-free reflow process

dc.typeProceedings paper
dspace.entity.typePublication
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