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Impact of moisture absorption on warpage of large BGA packages during a lead-free reflow process
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Impact of moisture absorption on warpage of large BGA packages during a lead-free reflow process
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Date
2009-10
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Deweerdt, Rafael
;
Duflos, Frederic
;
Gonzalez, Mario
;
Vanderstraeten, Daniel
;
Blansaer, Eddy
;
Brizar, Guy
;
Gillon, Renaud
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2008
since deposited on 2021-10-18
2
last month
Acq. date: 2025-12-11
Citations
Metrics
Views
2008
since deposited on 2021-10-18
2
last month
Acq. date: 2025-12-11
Citations