Browsing by author "Fluegel, Alexander"
Now showing items 1-3 of 3
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Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry
Inoue, Fumihiro; El-Mekki, Zaid; Struyf, Herbert; Hou, Lin; Derakhshandeh, Jaber; Beyne, Eric; Radisic, Alex; Hsia, Chih-Hao; Chang, Iris; Kutner, Elisabeth; Fluegel, Alexander; Arnold, Marco (2020) -
Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
El-Mekki, Zaid; Philipsen, Harold; Honore, Mia; Radisic, Alex; Slabbekoorn, John; Arnold, Marco; Fluegel, Alexander; Shu-Ya Chang, Iris; Struyf, Herbert; Mayer, Dieter (2016) -
Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
El-Mekki, Zaid; Radisic, Alex; Philipsen, Harold; Honore, Mia; Slabbekoorn, John; Struyf, Herbert; Arnold, Marco; Fluegel, Alexander; Mayer, Dieter; Shu-Ya Chang, Iris (2017)