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Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry
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Authors
Inoue, Fumihiro
;
El-Mekki, Zaid
;
Struyf, Herbert
;
Hou, Lin
;
Derakhshandeh, Jaber
;
Beyne, Eric
;
Radisic, Alex
;
Hsia, Chih-Hao
;
Chang, Iris
;
Kutner, Elisabeth
;
Fluegel, Alexander
;
Arnold, Marco
Conference
Electrochemical Society Spring Meeting Symposium E03: Electrodeposition of Alloys, Intermetallic Compounds, and Eutectics
Title
Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry
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