Browsing by author "Wang, Liang"
Now showing items 1-4 of 4
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An approach to produce a stack of photo definable polyimide based flat UTCPs
Priyabadini, Swarnakamal; Sterken, Tom; Wang, Liang; Dhaenens, Kristof; Vandecasteele, Bjorn; Van Put, Steven; Petersen, A.E.; Vanfleteren, Jan (2012) -
Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide
Wang, Liang; Sterken, Tom; Cauwe, Maarten; Cuypers, Dieter; Vanfleteren, Jan (2012) -
High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
Sterken, Tom; Op de Beeck, Maaike; Vermeiren, Filip; Torfs, Tom; Wang, Liang; Priyabadini, Swarnakamal; Dhaenens, Kristof; Cuypers, Dieter; Vanfleteren, Jan (2012) -
Self-aligned flat ultra-thin chip package for flexible circuits
Wang, Liang; Cauwe, Maarten; Brebels, Steven; De Raedt, Walter; Vanfleteren, Jan (2013)