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High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
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Authors
Sterken, Tom
;
Op de Beeck, Maaike
;
Vermeiren, Filip
;
Torfs, Tom
;
Wang, Liang
;
Priyabadini, Swarnakamal
;
Dhaenens, Kristof
;
Cuypers, Dieter
;
Vanfleteren, Jan
Conference
45th International Symposium on Microelectronics
Title
High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
Publication type
Proceedings paper
Embargo date
9999-12-31
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