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High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
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1 since deposited on 2021-10-20
Acq. date: 2025-10-28
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1909 since deposited on 2021-10-20
Acq. date: 2025-10-28
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1 since deposited on 2021-10-20
Acq. date: 2025-10-28
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1909 since deposited on 2021-10-20
Acq. date: 2025-10-28
Citations