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High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Date

2012
Proceedings Paper
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dc.contributor.authorSterken, Tom
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorVermeiren, Filip
dc.contributor.authorTorfs, Tom
dc.contributor.authorWang, Liang
dc.contributor.authorPriyabadini, Swarnakamal
dc.contributor.authorDhaenens, Kristof
dc.contributor.authorCuypers, Dieter
dc.contributor.authorVanfleteren, Jan
dc.contributor.imecauthorSterken, Tom
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorVermeiren, Filip
dc.contributor.imecauthorTorfs, Tom
dc.contributor.imecauthorDhaenens, Kristof
dc.contributor.imecauthorCuypers, Dieter
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.contributor.orcidimecTorfs, Tom::0000-0002-1302-3346
dc.contributor.orcidimecCuypers, Dieter::0000-0003-0550-6273
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-20T16:28:05Z
dc.date.available2021-10-20T16:28:05Z
dc.date.embargo9999-12-31
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21552
dc.source.beginpage940
dc.source.conference45th International Symposium on Microelectronics
dc.source.conferencedate9/09/2012
dc.source.conferencelocationSan Diego, CA USA
dc.title

High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

dc.typeProceedings paper
dspace.entity.typePublication
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