Browsing by author "Daily, Robert"
Now showing items 21-22 of 22
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Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process
Daily, Robert; Capuz, Giovanni; Miller, Andy; Bex, Pieter; Rebibis, Kenneth June (2012) -
Wafer reconstruction: An alternative 3D integration process flow
Wang, Teng; Silva, J.L.; Daily, Robert; Capuz, Giovanni; Gonzalez, Mario; Rebibis, Kenneth June; Kroehnert, S.; Beyne, Eric (2013)