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Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process
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Authors
Daily, Robert
;
Capuz, Giovanni
;
Miller, Andy
;
Bex, Pieter
;
Rebibis, Kenneth June
Conference
9th Annual International Wafer-Level Packaging Conference - IWLPC
Title
Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process
Publication type
Meeting abstract
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