Publication:
Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process
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1907 since deposited on 2021-10-20
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Acq. date: 2026-08-08
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Statistics
Views
1907 since deposited on 2021-10-20
1last month
1last week
Acq. date: 2026-08-08
Citations