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Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process

Date

2012
Meeting abstract
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dc.contributor.authorDaily, Robert
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorMiller, Andy
dc.contributor.authorBex, Pieter
dc.contributor.authorRebibis, Kenneth June
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.date.accessioned2021-10-20T10:26:54Z
dc.date.available2021-10-20T10:26:54Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20518
dc.source.beginpage1
dc.source.conference9th Annual International Wafer-Level Packaging Conference - IWLPC
dc.source.conferencedate5/11/2012
dc.source.conferencelocationSan Jose, CA USA
dc.source.endpage4
dc.title

Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process

dc.typeMeeting abstract
dspace.entity.typePublication
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