Wafer reconstruction: An alternative 3D integration process flow

Thumbnail
Metadata
Show full item record
Authors
Wang, Teng; Silva, J.L.; Daily, Robert; Capuz, Giovanni; Gonzalez, Mario; Rebibis, Kenneth June; Kroehnert, S.; Beyne, Eric
Conference
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)
Title
Wafer reconstruction: An alternative 3D integration process flow
Publication type
Proceedings paper
Collections