Browsing by author "Iacovo, Serena"
Now showing items 21-32 of 32
-
Multi-tier N=4 Binary Stacking, combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding Technology
Van Huylenbroeck, Stefaan; De Vos, Joeri; Teugels, Lieve; Iacovo, Serena; Fodor, Ferenc; Miller, Andy; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2021) -
Novel Cu/SiCN surface topography control for 1 mu m pitch hybrid wafer-to-wafer bonding
Kim, Soon-Wook; Fodor, Ferenc; Heylen, Nancy; Iacovo, Serena; De Vos, Joeri; Miller, Andy; Beyer, Gerald; Beyne, Eric (2020) -
On the manifestation of phosphorus-vacancy complexes in epitaxial Si:P films
Dhayalan, Sathish Kumar; Kujala, Jiri; Slotte, Jonatan; Pourtois, Geoffrey; Simoen, Eddy; Rosseel, Erik; Hikavyy, Andriy; Shimura, Yosuke; Iacovo, Serena; Stesmans, Andre; Loo, Roger; Vandervorst, Wilfried (2016) -
Origin of Voids at the SiO2/SiO2 and SiCN/SiCN Bonding Interface Using Positron Annihilation Spectroscopy and Electron Spin Resonance
Nagano, Fuya; Inoue, F.; Phommahaxay, Alain; Peng, Lan; Chancerel, Francois; Naser, Hasan; Beyer, Gerald; Uedono, A.; Beyne, Eric; De Gendt, Stefan; Iacovo, Serena (2023) -
Paramagnetic intrinsic defects in polycrystalline large-area 2D MoS2 films grown on SiO2 by Mo sulfurization
Stesmans, Andre; Iacovo, Serena; Chiappe, Daniele; Radu, Iuliana; Huyghebaert, Cedric; De Gendt, Stefan; Afanasiev, Valeri (2017) -
Paramagnetic oxide defects in Sc2O3-passivated (100)Ge/HfO2 stacks
Stesmans, Andre; Iacovo, Serena; Cott, Daire; Thean, Aaron; Arimura, Hiroaki; Sioncke, Sonja; Afanas'ev, Valeri (2014) -
Paths towards ultra high-density interconnect 3D systems: contribution of wafer geometry for achieving sub 200nm wafer-to-wafer bonding overlay
Iacovo, Serena; De Vos, Joeri; Phommahaxay, Alain; Miller, Andy; Beyne, Eric (2020) -
Pre-bonding characterization of SiCN enabled wafer stacking
Peng, Lan; Kim, Soon-Wook; Iacovo, Serena; Inoue, Fumihiro; De Vos, Joeri; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails
Veloso, Anabela; Jourdain, Anne; Radisic, Dunja; Chen, Rongmei; Arutchelvan, Goutham; O'Sullivan, Barry; Arimura, Hiroaki; Stucchi, Michele; De Keersgieter, An; Hosseini, Maryam; Hopf, Toby; D'have, Koen; Wang, Shouhua; Dupuy, Emmanuel; Mannaert, Geert; Vandersmissen, Kevin; Iacovo, Serena; Marien, Philippe; Choudhury, Subhobroto; Schleicher, Filip; Sebaai, Farid; Oniki, Yusuke; Zhou, X.; Gupta, Anshul; Schram, Tom; Briggs, Basoene; Lorant, Christophe; Rosseel, Erik; Hikavyy, Andriy; Loo, Roger; Geypen, Jef; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Soulie, Jean-Philippe; Devriendt, Katia; Chan, BT; Demuynck, Steven; Hiblot, Gaspard; Van der Plas, Geert; Ryckaert, Julien; Beyer, Gerald; Dentoni Litta, Eugenio; Beyne, Eric; Horiguchi, Naoto (2022) -
Synthesis of wafer-scale TMD films and heterostructures by chemical vapor sulfurization and selenization
Chiappe, Daniele; Asselberghs, Inge; Heyne, Markus; Iacovo, Serena; Sayan, Safak; Huyghebaert, Cedric; Caymax, Matty; Afanasiev, Valeri; Stesmans, Andre; Heyns, Marc; De Gendt, Stefan; Radu, Iuliana; Thean, Aaron (2016) -
The unique properties of SiCN as bonding material for hybrid bonding
Iacovo, Serena; Kim, Soon-Wook; Nagano, Fuya; Peng, Lan; Inoue, Fumihiro; Phommahaxay, Alain; Beyne, Eric (2021) -
Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding
Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Chancerel, Francois; Naser, Hasan; Beyer, Gerald; Beyne, Eric; De Gendt, Stefan (2022)