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Interconnection technology for advanced high density thick films

dc.contributor.authorVrana, M.
dc.contributor.authorVan Calster, Andre
dc.contributor.authorVanden Berghe, R.
dc.contributor.authorAllaert, K.
dc.date.accessioned2021-09-29T13:24:58Z
dc.date.available2021-09-29T13:24:58Z
dc.date.issued1995
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1003
dc.sourceIIOimport
dc.titleInterconnection technology for advanced high density thick films
dc.typeProceedings paper
dc.contributor.imecauthorVan Calster, Andre
dc.source.peerreviewno
dc.source.beginpage190
dc.source.endpage198
dc.source.conferenceProceedings of the 10th European Microelectronics Conference; May 1995; Copenhagen, Denmark.
dc.source.conferencelocation
imec.availabilityPublished - imec


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