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Multilayer thin film technology, enabling technology for system-in-a-package (SIP) and "above-IC" heterogenous sytem-on-chip (SOC) solutions

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T00:46:11Z
dc.date.available2021-10-16T00:46:11Z
dc.date.issued2005-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10097
dc.sourceIIOimport
dc.titleMultilayer thin film technology, enabling technology for system-in-a-package (SIP) and "above-IC" heterogenous sytem-on-chip (SOC) solutions
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage14
dc.source.endpage21
dc.source.conferenceProceedings of the International Conference on Electronics Packaging - ICEP
dc.source.conferencedate13/04/2005
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


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