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System-driven approaches to 3D integration

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T00:46:15Z
dc.date.available2021-10-16T00:46:15Z
dc.date.issued2005-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10098
dc.sourceIIOimport
dc.titleSystem-driven approaches to 3D integration
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage25
dc.source.endpage34
dc.source.conferenceProceedings of the 4th International Symposium on Microelectronics and Packaging, ISMP2005
dc.source.conferencedate28/09/2005
dc.source.conferencelocationSeoul Korea
imec.availabilityPublished - imec


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