| dc.contributor.author | Beyne, Eric | |
| dc.date.accessioned | 2021-10-16T00:46:18Z | |
| dc.date.available | 2021-10-16T00:46:18Z | |
| dc.date.issued | 2005-05 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/10099 | |
| dc.source | IIOimport | |
| dc.title | Multilayer thin film technology - Enabling technology for SiP and "above-IC" heterogeneous SOC solutions | |
| dc.type | Proceedings paper | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.source.peerreview | no | |
| dc.source.conference | Proceedings of the Encast International Workshop - CAST. "Challenges for Advanced Semiconductor-Die Technologies" | |
| dc.source.conferencedate | 16/05/2005 | |
| dc.source.conferencelocation | Barcelona Spain | |
| imec.availability | Published - imec | |
