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Electrodeposition for copper metallization

dc.contributor.authorBrongersma, Sywert
dc.date.accessioned2021-10-16T00:50:54Z
dc.date.available2021-10-16T00:50:54Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10159
dc.sourceIIOimport
dc.titleElectrodeposition for copper metallization
dc.typeOral presentation
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.conferenceAdvanced Metallization Conference
dc.source.conferencedate26/09/2005
dc.source.conferencelocationColorado Springs, CO USA
imec.availabilityPublished - imec
imec.internalnotesShort-course held in conjunction with AMC conference


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