Metallization for future interconnects
dc.contributor.author | Brongersma, Sywert | |
dc.date.accessioned | 2021-10-16T00:50:59Z | |
dc.date.available | 2021-10-16T00:50:59Z | |
dc.date.issued | 2005 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/10160 | |
dc.source | IIOimport | |
dc.title | Metallization for future interconnects | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Brongersma, Sywert | |
dc.contributor.orcidimec | Brongersma, Sywert::0000-0002-1755-3897 | |
dc.source.peerreview | no | |
dc.source.conference | Semicon Japan | |
dc.source.conferencedate | 7/12/2005 | |
dc.source.conferencelocation | Tokyo Japan | |
imec.availability | Published - imec |
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