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Thermal desorption spectrometry as a method of analysis for advanced interconnect materials

dc.contributor.authorCarbonell, Laure
dc.contributor.authorMartin Hoyas, Ana
dc.contributor.authorWhelan, Caroline
dc.contributor.authorVereecke, Guy
dc.date.accessioned2021-10-16T00:52:22Z
dc.date.available2021-10-16T00:52:22Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10175
dc.sourceIIOimport
dc.titleThermal desorption spectrometry as a method of analysis for advanced interconnect materials
dc.typeBook chapter
dc.contributor.imecauthorVereecke, Guy
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage451
dc.source.bookMaterials for Information Technology. Devices, Interconnects and Packaging
dc.source.endpage459
imec.availabilityPublished - open access
imec.internalnotesPaper from EUROMAT 2003


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