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Conference contributions
Filling of 80nm trenches using a novel copper oxide reduction and reflow approach
Publication:
Filling of 80nm trenches using a novel copper oxide reduction and reflow approach
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Date
2005
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Carbonell, Laure
;
Palmans, Roger
;
Travaly, Youssef
;
Tokei, Zsolt
;
Jonas, Alain M.
;
Brongersma, Sywert
;
Maex, Karen
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1882
since deposited on 2021-10-16
Acq. date: 2025-12-09
Citations
Metrics
Views
1882
since deposited on 2021-10-16
Acq. date: 2025-12-09
Citations