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Thin-film for the realization of high quality on-chip and in-package passives

dc.contributor.authorCarchon, Geert
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T00:52:45Z
dc.date.available2021-10-16T00:52:45Z
dc.date.issued2005-01
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10179
dc.sourceIIOimport
dc.titleThin-film for the realization of high quality on-chip and in-package passives
dc.typeProceedings paper
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceAdvanced Technology Workshop on Passive Integration
dc.source.conferencedate24/01/2005
dc.source.conferencelocationMarco Island, FL USA
imec.availabilityPublished - imec


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