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Thin-film as enabling passive integration technology for RF SoC and SiP

dc.contributor.authorCarchon, Geert
dc.contributor.authorSun, Xiao
dc.contributor.authorPosada Quijano, Guillermo
dc.contributor.authorLinten, Dimitri
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T00:53:20Z
dc.date.available2021-10-16T00:53:20Z
dc.date.issued2005-02
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10185
dc.sourceIIOimport
dc.titleThin-film as enabling passive integration technology for RF SoC and SiP
dc.typeProceedings paper
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage398
dc.source.endpage399
dc.source.conferenceIEEE International Solid-State Circuits Conference - ISSCC. Digest of Technical Papers
dc.source.conferencedate6/02/2005
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesVol.1


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