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Electro-thermal-mechanical analysis of a HQUAD package for high current and high power application

dc.contributor.authorChen, Caroline
dc.contributor.authorOprins, Herman
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBrizar, Guy
dc.contributor.authorVanderstraeten, Daniel
dc.contributor.authorBlansaer, Eddy
dc.date.accessioned2021-10-16T00:55:35Z
dc.date.available2021-10-16T00:55:35Z
dc.date.issued2005-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10206
dc.sourceIIOimport
dc.titleElectro-thermal-mechanical analysis of a HQUAD package for high current and high power application
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewyes
dc.source.beginpage173
dc.source.endpage178
dc.source.conferenceProceedings of the International Workshop on Thermal Investigations of ICs and Systems
dc.source.conferencedate28/09/2005
dc.source.conferencelocationBelgirate Italy
imec.availabilityPublished - imec


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