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Hybrid integration of multi-finger HEMTs: A comparison between flip-chip and substrate removal

dc.contributor.authorDas, Johan
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorVandersmissen, Raf
dc.contributor.authorOprins, Herman
dc.contributor.authorDerluyn, Joff
dc.contributor.authorGermain, Marianne
dc.contributor.authorBorghs, Gustaaf
dc.date.accessioned2021-10-16T01:05:26Z
dc.date.available2021-10-16T01:05:26Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10282
dc.sourceIIOimport
dc.titleHybrid integration of multi-finger HEMTs: A comparison between flip-chip and substrate removal
dc.typeOral presentation
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBorghs, Gustaaf
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.source.peerreviewno
dc.source.conferenceInternational Conference on Nitride Semiconductors
dc.source.conferencedate28/08/2005
dc.source.conferencelocationBremen Germany
imec.availabilityPublished - imec


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