dc.contributor.author | Das, Johan | |
dc.contributor.author | Ruythooren, Wouter | |
dc.contributor.author | Vandersmissen, Raf | |
dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Derluyn, Joff | |
dc.contributor.author | Germain, Marianne | |
dc.contributor.author | Borghs, Gustaaf | |
dc.date.accessioned | 2021-10-16T01:05:26Z | |
dc.date.available | 2021-10-16T01:05:26Z | |
dc.date.issued | 2005 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/10282 | |
dc.source | IIOimport | |
dc.title | Hybrid integration of multi-finger HEMTs: A comparison between flip-chip and substrate removal | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Ruythooren, Wouter | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.imecauthor | Borghs, Gustaaf | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.source.peerreview | no | |
dc.source.conference | International Conference on Nitride Semiconductors | |
dc.source.conferencedate | 28/08/2005 | |
dc.source.conferencelocation | Bremen Germany | |
imec.availability | Published - imec | |