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Technology development for 3D integration at IMEC

dc.contributor.authorDe Moor, Piet
dc.date.accessioned2021-10-16T01:09:13Z
dc.date.available2021-10-16T01:09:13Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10307
dc.sourceIIOimport
dc.titleTechnology development for 3D integration at IMEC
dc.typeOral presentation
dc.contributor.imecauthorDe Moor, Piet
dc.source.peerreviewno
dc.source.conference3D Architectures for Semiconductor Integration and Packaging
dc.source.conferencedate13/06/2005
dc.source.conferencelocationTempe, AZ USA
imec.availabilityPublished - imec


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