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3D Interconnect technology for space applications

dc.contributor.authorDe Moor, Piet
dc.contributor.authorDe Munck, Koen
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorBaert, Kris
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-16T01:09:40Z
dc.date.available2021-10-16T01:09:40Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10310
dc.sourceIIOimport
dc.title3D Interconnect technology for space applications
dc.typeProceedings paper
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceESA Round Table on Micro/Nano Technologies for Space
dc.source.conferencedate3/10/2005
dc.source.conferencelocationNoordwijk The Netherlands
imec.availabilityPublished - imec
imec.internalnotesESA WPP 255 (CD-ROM)


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