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Cu bonding to Cu low K wafers: a systematic study of the mechanical bonding process

dc.contributor.authorDegryse, Dominiek
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T01:17:44Z
dc.date.available2021-10-16T01:17:44Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10361
dc.sourceIIOimport
dc.titleCu bonding to Cu low K wafers: a systematic study of the mechanical bonding process
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage41
dc.source.endpage48
dc.source.conferenceProceedings of the 6th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics
dc.source.conferencedate18/04/2005
dc.source.conferencelocationBerlin Germany
imec.availabilityPublished - imec


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