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Modeling of energy capability of power devices with copper layer integration

dc.contributor.authorElattari, Brahim
dc.contributor.authorDriessens, Evelien
dc.contributor.authorWebers, Tomas
dc.contributor.authorVan den Bosch, Geert
dc.contributor.authorMoens, P.
dc.contributor.authorGroeseneken, Guido
dc.date.accessioned2021-10-16T01:29:12Z
dc.date.available2021-10-16T01:29:12Z
dc.date.issued2005-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10425
dc.sourceIIOimport
dc.titleModeling of energy capability of power devices with copper layer integration
dc.typeProceedings paper
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorVan den Bosch, Geert
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecVan den Bosch, Geert::0000-0001-9971-6954
dc.source.peerreviewno
dc.source.beginpage207
dc.source.endpage210
dc.source.conferenceProceedings of the International Conference on Simulation of Semiconductor Processes and Devices - SISPAD
dc.source.conferencedate1/09/2005
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


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