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Development of very thin (<30μm) germanium substrates enabling high-voltage integrated multi-junction modules

dc.contributor.authorFlamand, Giovanni
dc.contributor.authorGeens, Wim
dc.contributor.authorvan der Heide, Johan
dc.contributor.authorSimons, Eddy
dc.contributor.authorTaylor, Stephen
dc.date.accessioned2021-10-16T01:34:40Z
dc.date.available2021-10-16T01:34:40Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10453
dc.sourceIIOimport
dc.titleDevelopment of very thin (<30μm) germanium substrates enabling high-voltage integrated multi-junction modules
dc.typeProceedings paper
dc.contributor.imecauthorFlamand, Giovanni
dc.contributor.imecauthorvan der Heide, Johan
dc.contributor.orcidimecFlamand, Giovanni::0000-0002-7863-3022
dc.source.peerreviewyes
dc.source.conferenceProceedings of the 7th European Space Power Conference
dc.source.conferencedate9/05/2005
dc.source.conferencelocationStresa Italy
imec.availabilityPublished - imec
imec.internalnotesESA SP-589


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