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The influence of wafer soaking and top coat processing on resist profile control in immersion lithography

dc.contributor.authorFoubert, Philippe
dc.contributor.authorVandenbroeck, Nadia
dc.contributor.authorDelvaux, Christie
dc.contributor.authorPollentier, Ivan
dc.contributor.authorErcken, Monique
dc.date.accessioned2021-10-16T01:35:39Z
dc.date.available2021-10-16T01:35:39Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10458
dc.sourceIIOimport
dc.titleThe influence of wafer soaking and top coat processing on resist profile control in immersion lithography
dc.typeProceedings paper
dc.contributor.imecauthorFoubert, Philippe
dc.contributor.imecauthorVandenbroeck, Nadia
dc.contributor.imecauthorDelvaux, Christie
dc.contributor.imecauthorPollentier, Ivan
dc.contributor.imecauthorErcken, Monique
dc.contributor.orcidimecPollentier, Ivan::0000-0002-4266-6500
dc.source.peerreviewno
dc.source.conference2nd International Symposium on Immersion Lithograpy
dc.source.conferencedate12/09/2005
dc.source.conferencelocationBrugge Belgium
imec.availabilityPublished - imec


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