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Scaling down thickness of ULK materials for 65 node and below and its efect on electrical performance

dc.contributor.authorFruhauf, S.
dc.contributor.authorHimcinschi, C.
dc.contributor.authorRennau, M.
dc.contributor.authorSchulze, K.
dc.contributor.authorSchulz, S.E.
dc.contributor.authorFriedrich, M.
dc.contributor.authorGessner, T.
dc.contributor.authorZahn, D.R.T.
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorCaluwaerts, Rudy
dc.date.accessioned2021-10-16T01:37:58Z
dc.date.available2021-10-16T01:37:58Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10470
dc.sourceIIOimport
dc.titleScaling down thickness of ULK materials for 65 node and below and its efect on electrical performance
dc.typeJournal article
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorCaluwaerts, Rudy
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.source.peerreviewno
dc.source.beginpage405
dc.source.endpage410
dc.source.journalMicroelectronic Engineering
dc.source.issue3_4
dc.source.volume82
imec.availabilityPublished - imec
imec.internalnotesProc. 9th Eur. Workshop on Materials for Advanced Metallization; March 2005; Dresden


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