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dc.contributor.authorFruhauf, S.
dc.contributor.authorHimcinschi, C.
dc.contributor.authorRennau, M.
dc.contributor.authorSchulze, K.
dc.contributor.authorSchulz, S.E.
dc.contributor.authorFriedrich, M.
dc.contributor.authorGessner, T.
dc.contributor.authorZahn, D.R.T.
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorCaluwaerts, Rudy
dc.date.accessioned2021-10-16T01:37:58Z
dc.date.available2021-10-16T01:37:58Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10470
dc.sourceIIOimport
dc.titleScaling down thickness of ULK materials for 65 node and below and its efect on electrical performance
dc.typeJournal article
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorCaluwaerts, Rudy
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.source.peerreviewno
dc.source.beginpage405
dc.source.endpage410
dc.source.journalMicroelectronic Engineering
dc.source.issue3_4
dc.source.volume82
imec.availabilityPublished - imec
imec.internalnotesProc. 9th Eur. Workshop on Materials for Advanced Metallization; March 2005; Dresden


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