Authors

Fruhauf, S.; Himcinschi, C.; Rennau, M.; Schulze, K.; Schulz, S.E.; Friedrich, M.; Gessner, T.; Zahn, D.R.T.; Le, Quoc Toan; Caluwaerts, Rudy

Issue

3_4

Journal

Microelectronic Engineering

Volume

82

Title

Scaling down thickness of ULK materials for 65 node and below and its efect on electrical performance

Publication type

Journal article