Publication:
Scaling down thickness of ULK materials for 65 node and below and its efect on electrical performance
Date
| dc.contributor.author | Fruhauf, S. | |
| dc.contributor.author | Himcinschi, C. | |
| dc.contributor.author | Rennau, M. | |
| dc.contributor.author | Schulze, K. | |
| dc.contributor.author | Schulz, S.E. | |
| dc.contributor.author | Friedrich, M. | |
| dc.contributor.author | Gessner, T. | |
| dc.contributor.author | Zahn, D.R.T. | |
| dc.contributor.author | Le, Quoc Toan | |
| dc.contributor.author | Caluwaerts, Rudy | |
| dc.contributor.imecauthor | Le, Quoc Toan | |
| dc.contributor.imecauthor | Caluwaerts, Rudy | |
| dc.contributor.orcidimec | Le, Quoc Toan::0000-0002-0206-6279 | |
| dc.date.accessioned | 2021-10-16T01:37:58Z | |
| dc.date.available | 2021-10-16T01:37:58Z | |
| dc.date.issued | 2005 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/10470 | |
| dc.source.beginpage | 405 | |
| dc.source.endpage | 410 | |
| dc.source.issue | 3_4 | |
| dc.source.journal | Microelectronic Engineering | |
| dc.source.volume | 82 | |
| dc.title | Scaling down thickness of ULK materials for 65 node and below and its efect on electrical performance | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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