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Thermo-mechanical FEM analysis of lead free and lead containing solder for flip chip applications

dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorManessis, Dionysios
dc.date.accessioned2021-10-16T01:45:22Z
dc.date.available2021-10-16T01:45:22Z
dc.date.issued2005-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10505
dc.sourceIIOimport
dc.titleThermo-mechanical FEM analysis of lead free and lead containing solder for flip chip applications
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.beginpage440
dc.source.endpage445
dc.source.conferenceProceedings 15th European Microelectronics and Packaging Conference & Exhibition - IMAPS
dc.source.conferencedate12/06/2005
dc.source.conferencelocationBrugge Belgium
imec.availabilityPublished - imec


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