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Different failure signatures of multiple TLP and HBM stresses in an ESD robust protection structure

dc.contributor.authorGuitard, Nicolas
dc.contributor.authorEssely, Fabien
dc.contributor.authorTremouilles, David
dc.contributor.authorBafleur, Marise
dc.contributor.authorNolhier, Nicolas
dc.contributor.authorPerdu, Philippe
dc.contributor.authorTouboul, Andre
dc.contributor.authorPouget, Vincent
dc.contributor.authorLewis, Dean
dc.date.accessioned2021-10-16T01:51:51Z
dc.date.available2021-10-16T01:51:51Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10535
dc.sourceIIOimport
dc.titleDifferent failure signatures of multiple TLP and HBM stresses in an ESD robust protection structure
dc.typeJournal article
dc.source.peerreviewno
dc.source.beginpage1415
dc.source.endpage1420
dc.source.journalMicroelectronics Reliability
dc.source.issue9_11
dc.source.volume45
imec.availabilityPublished - imec
imec.internalnotesProceedings of the 16th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis; Oct. 2005; Bordeaux


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