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Challenges in the implentation of low-k dielectrics in the back-end of line

dc.contributor.authorHoofman, Romano
dc.contributor.authorBrom - Verheyden, Greja
dc.contributor.authorMichelon, Julien
dc.contributor.authorIacopi, Francesca
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-16T02:08:02Z
dc.date.available2021-10-16T02:08:02Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10602
dc.sourceIIOimport
dc.titleChallenges in the implentation of low-k dielectrics in the back-end of line
dc.typeJournal article
dc.contributor.imecauthorHoofman, Romano
dc.contributor.imecauthorBrom - Verheyden, Greja
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecHoofman, Romano::0000-0001-8740-104X
dc.source.peerreviewno
dc.source.beginpage337
dc.source.endpage344
dc.source.journalMicroelectronic Engineering
dc.source.volume80
imec.availabilityPublished - imec
imec.internalnotesPaper from 14th Int. Conf. on Insulating Films on Semiconductors; June 2005; Leuven


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