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Flip chip mounting for improved thermal management of AlGaN/GaN HFETs
Publication:
Flip chip mounting for improved thermal management of AlGaN/GaN HFETs
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Date
2005
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ji, Hangfeng
;
Sarua, A.
;
Kuball, Martin
;
Das, Johan
;
Ruythooren, Wouter
;
Germain, Marianne
;
Borghs, Gustaaf
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1930
since deposited on 2021-10-16
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last week
Acq. date: 2026-01-06
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Metrics
Views
1930
since deposited on 2021-10-16
2
last month
2
last week
Acq. date: 2026-01-06
Citations