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Indium solder bump technology for ultra high density interconnects in hybrid image sensors

dc.contributor.authorJohn, Joachim
dc.contributor.authorDe Moor, Piet
dc.contributor.authorColin, Thierry
dc.contributor.authorDe Kerckhove, Alex
dc.contributor.authorBorgers, Tom
dc.contributor.authorHooylaerts, Peter
dc.contributor.authorDe Munck, Koen
dc.contributor.authorTezcan, Denizs
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-16T02:21:17Z
dc.date.available2021-10-16T02:21:17Z
dc.date.issued2005-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10654
dc.sourceIIOimport
dc.titleIndium solder bump technology for ultra high density interconnects in hybrid image sensors
dc.typeProceedings paper
dc.contributor.imecauthorJohn, Joachim
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorBorgers, Tom
dc.contributor.imecauthorHooylaerts, Peter
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecBorgers, Tom::0000-0002-7878-6977
dc.source.peerreviewyes
dc.source.beginpage334
dc.source.endpage337
dc.source.conferenceProceedings of the 15th European Microelectronics and Packaging Conference & Exhibition - IMAPS/EMPC
dc.source.conferencedate12/06/2005
dc.source.conferencelocationBrugge Belgium
imec.availabilityPublished - imec


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