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Techniques for substrate bonding

dc.contributor.authorBaert, Kris
dc.contributor.authorDeferm, Ludo
dc.contributor.authorJansen, Philippe
dc.contributor.authorRosmeulen, Maarten
dc.contributor.authorvan der Groen, Sonja
dc.date.accessioned2021-09-29T14:16:13Z
dc.date.available2021-09-29T14:16:13Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1065
dc.sourceIIOimport
dc.titleTechniques for substrate bonding
dc.typeProceedings paper
dc.contributor.imecauthorDeferm, Ludo
dc.contributor.imecauthorRosmeulen, Maarten
dc.contributor.orcidimecRosmeulen, Maarten::0000-0002-3663-7439
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage762
dc.source.endpage764
dc.source.conferenceMicro System Technologies 96; 5th International Conferenceon Micro Electro, Opto, Mechanical Systems and Components
dc.source.conferencedate17/09/1996
dc.source.conferencelocationPotsdam Germany
imec.availabilityPublished - open access


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