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Hermeticity investigation of sealed 0-level packages based on the damping characteristics of the MEMS device

dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorDe Moor, Piet
dc.contributor.authorPuers, Bob
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-16T02:23:22Z
dc.date.available2021-10-16T02:23:22Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10663
dc.sourceIIOimport
dc.titleHermeticity investigation of sealed 0-level packages based on the damping characteristics of the MEMS device
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorPuers, Bob
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpage222
dc.source.endpage227
dc.source.conferenceProceedings 15th European Microelectronics and Packaging Conference - EPMC
dc.source.conferencedate12/06/2005
dc.source.conferencelocationBrugge Belgium
imec.availabilityPublished - imec


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