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Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-) MEMS devices

dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Moor, Piet
dc.contributor.authorBaert, Kris
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-16T02:23:37Z
dc.date.available2021-10-16T02:23:37Z
dc.date.issued2005-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10664
dc.sourceIIOimport
dc.titleMechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-) MEMS devices
dc.typeJournal article
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpageS89
dc.source.endpageS96
dc.source.journalJournal of Micromechanics and Microengineering
dc.source.issue7
dc.source.volume15
imec.availabilityPublished - imec


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